Project Details

Inovace výrobní linky pro tvorbu vícevrstvých desek plošných spojů

Project Period: 1. 4. 2015 - 31. 12. 2015

Project Type: grant

Code: FEKT/FIT-J-15-2832

Agency: Brno University of Technology

Program: Vnitřní projekty VUT

English title
Innovation of technical equipment for multilayer printed circuit boards
Type
grant
Keywords

Printed circuit board, through-hole plating, fine pitch applications.

Abstract

The aim of the project is to innovate the process of through-hole copper plating of a PCB to ensure stable quality of results and lower the power consumption.

Team members
Otáhal Alexandr, Ing., Ph.D. (FEKT VUT) , research leader
Crha Adam, Ing., Ph.D. (UPSY FIT VUT) , team leader
Růžička Richard, doc. Ing., Ph.D., MBA (UPSY FIT VUT) , team leader
Szendiuch Ivan, Doc. Ing., CSc. (UMEL FEKT VUT)
Publications

2016

  • OTÁHAL Alexandr, ŠIMEK Václav, CRHA Adam, RŮŽIČKA Richard and SZENDIUCH Ivan. Innovative Methods for Through Holes Plating. In: 2016 39th International Spring Seminar on Electronics Technology (ISSE). Plzeň: IEEE Computer Society, 2016, pp. 48-52. ISBN 978-1-5090-1389-0. Detail
  • OTÁHAL Alexandr, ŠIMEK Václav, CRHA Adam, RŮŽIČKA Richard and SZENDIUCH Ivan. Innovative Methods in Activation Process of Through-hole Plating. Periodica Polytechnica Electrical Engineering and Computer Science, vol. 60, no. 4, 2016, pp. 217-222. ISSN 2064-5279. Detail
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